Harsh environment electronics : interconnect materials and performance assessment /
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
Weinheim, Germany :
Wiley-VCH Verlag GmbH & Co.,
[2019]
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| Subjects: | |
| Online Access: | CONNECT |
