Collusion along the learning curve : theory and evidence from semiconductor industry / by Asmat, Danial

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Chemical vapor deposition /

Table of Contents: “…Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications /…”
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La jurisprudence de l'OMC,

Table of Contents: “…FOREWORD; DS99 United States -- Anti-Dumping Duty on Dynamic Random Access Memory Semiconductors (DRAMS) of one Megabit or above from Korea by Geneviève Burdeau; Korea -- Taxes on Alcoholic Beverages by Sandrine Maljean-Dubois; Japan -- Measures Affecting Agricultural Products by Vincent Tomkiewicz; Canada -- Measures Affecting the Export of Civilian Aircraft by Stanimir A. …”
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Dispute Settlement Reports 2005.

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Dispute Settlement Reports 2005.

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Dispute Settlement Reports 2005.

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Dispute Settlement Reports 1999.

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A journey of embedded and cyber-physical systems : essays dedicated to Peter Marwedel on the occasion of his 70th birthday /

Table of Contents: “…Chapter 3. The Dynamic Random Access Memory Challenge in Embedded Computing Systems -- Chapter 4. …”
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Semiconductor memories and systems /

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Handbook of VLSI microlithography : principles, technology, and applications /

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Laser cleaning : optical physics, applied physics and materials science /

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Fuzzy systems and data mining II : proceedings of FSDM 2016 /

Table of Contents: “…Yield Rate Prediction of a Dynamic Random Access Memory Manufacturing Process Using Artificial Neural NetworkMining Probabilistic Frequent Itemsets with Exact Methods; Performance Degradation Analysis Method Using Satellite Telemetry Big Data; A Decision Tree Model for Meta-Investment Strategy of Stock Based on Sector Rotating; Virtualized Security Defense System for Blurred Boundaries of Next Generation Computing Era; Implicit Feature Identification in Chinese Reviews Based on Hybrid Rules; Characteristics Analysis and Data Mining of Uncertain Influence Based on Power Law.…”
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Learning computer architecture with Raspberry Pi / by Upton, Eben, Duntemann, Jeff, Everard, Ben, Davis, Russell

Table of Contents: “…Rotating Magnetic MemoryMagnetic Core Memory; Static Random Access Memory (SRAM); Address Lines and Data Lines; Combining Memory Chips into Memory Systems; Dynamic Random Access Memory (DRAM); The Raspberry Pi Memory System; Cache; Virtual Memory; Chapter 4: ARM Processors and Systems-on-a-Chip; The Incredible Shrinking CPU; Digital Logic Primer; Inside the CPU; Rethinking the CPU: CISC vs. …”
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Learning computer architecture with Raspberry Pi / by Upton, Eben, Duntemann, Jeff, Everard, Ben, Davis, Russell

Table of Contents: “…Rotating Magnetic MemoryMagnetic Core Memory; Static Random Access Memory (SRAM); Address Lines and Data Lines; Combining Memory Chips into Memory Systems; Dynamic Random Access Memory (DRAM); The Raspberry Pi Memory System; Cache; Virtual Memory; Chapter 4: ARM Processors and Systems-on-a-Chip; The Incredible Shrinking CPU; Digital Logic Primer; Inside the CPU; Rethinking the CPU: CISC vs. …”
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Emerging nanoelectronic devices /

Table of Contents: “…Memory Technologies: Status and Perspectives; 3.1 Introduction: Baseline Memory Technologies; 3.2 Essential Physics of Charge-based Memory; 3.3 Dynamic Random Access Memory.…”
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Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used / by Domingo, George, 1937-

Table of Contents: “…. ; Summary and conclusions ; Appendix 4.1 -- Light Diffraction ; Appendix 4.2 -- Black Body Radiation ; Chapter 5 -- The pn-junction ; Objectives of this chapter ; 5.1 -- The pn-junction ; 5.2 -- The Semiconductor Diode ; 5.3 -- The Schottky Diode ; 5.4 -- The Zener or Tunnel Diode ; Conclusions and Summary ; Appendix 5.1 -- Fermi levels of a pn junction ; Appendix 5.2 -- Diffusion and drift currents ; Appendix 5.3 -- The thickness of the transition region ; Appendix 5.4 -- Work Function and the Shockley diode ; Chapter 6 -- Other Electrical Components ; Objective of this chapter ; 6.1 -- Voltage and Current ; 6.2 -- The Resistance ; 6.3 -- The Capacitor ; 6.4 -- The Inductor ; 6.5 -- Sinusoidal Voltages ; 6.6 -- Inductor application ; Conclusions and summary ; Appendix 6.1 -- Impedance and phase changes ; Chapter 7 -- Diode Applications ; 7.1 -- Solar Cells ; 7.2 -- Rectifiers ; 7.3 -- Current Protection ; 7.4 -- Clamping Circuit ; 7.5 -- Voltage Clipper ; 7.6 -- Half-Wave Voltage Doubler ; 7.7 -- Solar Cells Bypass diodes ; 7.8 -- Applications of Shockley Diodes ; 7.9 -- Application of Zener Diodes ; Conclusion and summary ; Appendix 7.1 -- Details on the voltage doubler ; Chapter 8 -- The Transistors ; OBCETIVE OF THIS CHAPTER ; 8.1 -- The concept of the transistor ; 8.2 -- The Bipolar Junction Transistor, BJT ; 8.3 -- The Junction Field Effect Transistor, JFET ; 8.4 -- The MOSFET ; Conclusions and summary ; Chapter 9 -- Transistor Biasing Circuits ; Objective of this chapter ; 9.1 -- Introduction ; 9.2 -- Emitter Feedback Bias ; 9.3 -- A simple transistor amplifier ; 9.4 -- A fixed bias circuit ; 9.5 -- The Collector bias circuit ; 9.6 -- Power considerations ; 9.7 -- Multi-stage transistor amplifiers ; 9.8 -- Operational amplifier, OpAmp ; 9.9 -- The ideal OpAmp ; Summary and Conclusions ; Appendix 9.1 -- Derivation of the stability of Collector feedback ; Chapter 10 -- Integrated circuit (IC) fabrication ; Objective of this chapter ; 10.1 -- The basic material ; 10.2 -- The Boule ; 10.2.1 -- The Czochralski method ; 10.2.2 -- The Flow-Zone method ; 10.3 -- The wafers and epitaxial growth ; 10.4 -- Photolithography ; 10.5 -- The fabrication of a pnp transistor on a silicon waver ; 10.6 -- A digression on doping ; 10.6.1 -- Thermal diffusion ; 10.6.2 -- Implantation ; 10.7 -- Resume our transistor processing ; 10.7.1 -- The contacts ; 10.7.2 -- Metallization ; 10.7.3 -- Multiple interconnects ; 10.8 -- Fabrication of other components ; 10.8.1 The integrated resistor ; 10.8.2 The integrated capacitor ; 10.8.3 Integrated inductor ; 10.9 -- Testing and Packaging ; 10.10 -- Clean rooms ; 10.11 -- Additional thoughts about processing ; Appendix 10.1 -- Miller indices in the diamond structure ; Chapter 11 -- Logic circuits ; Objectives of this chapter ; 11.1 -- Boolean algebra ; 11.2 -- The logic symbols ; 11.3 -- The electronic inside the symbols ; 11.3.1 -- Diode implementation ; 11.3.2 -- CMOS implementation ; 11.4- The inverter of NOT circuit ; 11.5 -- The NOR circuit ; 11.6 -- The NAND circuit ; 11.7 -- The XNOR or the exclusive NOR ; 11.8 -- The half adder ; 11.9 -- The full adder ; 11.10 -- Adding more than two digital numbers ; 11.11 -- The subtractor ; 11.12 -- Digression; flip-flops, latches and shifters ; 11.13 -- Multiplication and division of binary numbers ; 11.14 -- Additional comments, speed and power ; Conclusion and summary ; Appendix 11.1 -- Algebraic formulation of logic modules ; Appendix 11.2 -- Detailed analysis of the full adder ; Appendix 11.3 -- Complementary numbers ; Appendix 11.4 -- Dividing digital numbers ; Chapter 12 -- VLSI components ; Objectives of this chapter ; 12.1 -- Multiplexers, MUX ; 12.2 -- De-multiplexer, DEMUX ; 12.3 -- Registers ; 12.4 -- Timing and Waveforms ; 12.5 -- Memories ; 12.5.1 -- The Static Random-Access Memory, SRAM ; 12.5.2 -- The Dynamic Random-Access memory, DRAM ; 12.5.3 -- Read Only Memory, ROM ; 12.5.4 -- Programable Read only Memory, PROM ; 12.6 -- Gate arrays ; Conclusions and summary ; Appendix 12.1 -- A NAND implementation of a 2 to 1 MUX ; Chapter 13 -- Opto-Electronics ; Objective of this chapter ; 13.1 -- Photoconductors ; 13.2- PIN diodes ; 13.3 -- Lasers ; 13.3.1 -- The laser action ; 13.3.2 -- Solid State lasers ; 13.3.3 -- Semiconductor Lasers ; 13.3.4 -- Laser applications ; 13.4 -- Light Emitting Diodes, LEDs ; Summary and Conclusions ; Appendix 13.1 -- The detector readout ; Chapter 14 -- Microprocessors and computers ; 14.1 -- The computer ; 14.1.1 -- The computer architecture ; 14.1.2 -- The Memories ; 14.1.3 -- Input and output units ; 14.1.4 -- The central processing unit, CPU ; 14.2 -- Microcontrollers ; 14.3 -- Liquid Crystal Displays, LCDs ; 14.3.1 -- Liquid Crystal materials ; 14.3.2 -- The contacts ; 14.3.3 -- The color Filters ; 14.…”
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Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used / by Domingo, George, 1937-

Table of Contents: “…. ; Summary and conclusions ; Appendix 4.1 -- Light Diffraction ; Appendix 4.2 -- Black Body Radiation ; Chapter 5 -- The pn-junction ; Objectives of this chapter ; 5.1 -- The pn-junction ; 5.2 -- The Semiconductor Diode ; 5.3 -- The Schottky Diode ; 5.4 -- The Zener or Tunnel Diode ; Conclusions and Summary ; Appendix 5.1 -- Fermi levels of a pn junction ; Appendix 5.2 -- Diffusion and drift currents ; Appendix 5.3 -- The thickness of the transition region ; Appendix 5.4 -- Work Function and the Shockley diode ; Chapter 6 -- Other Electrical Components ; Objective of this chapter ; 6.1 -- Voltage and Current ; 6.2 -- The Resistance ; 6.3 -- The Capacitor ; 6.4 -- The Inductor ; 6.5 -- Sinusoidal Voltages ; 6.6 -- Inductor application ; Conclusions and summary ; Appendix 6.1 -- Impedance and phase changes ; Chapter 7 -- Diode Applications ; 7.1 -- Solar Cells ; 7.2 -- Rectifiers ; 7.3 -- Current Protection ; 7.4 -- Clamping Circuit ; 7.5 -- Voltage Clipper ; 7.6 -- Half-Wave Voltage Doubler ; 7.7 -- Solar Cells Bypass diodes ; 7.8 -- Applications of Shockley Diodes ; 7.9 -- Application of Zener Diodes ; Conclusion and summary ; Appendix 7.1 -- Details on the voltage doubler ; Chapter 8 -- The Transistors ; OBCETIVE OF THIS CHAPTER ; 8.1 -- The concept of the transistor ; 8.2 -- The Bipolar Junction Transistor, BJT ; 8.3 -- The Junction Field Effect Transistor, JFET ; 8.4 -- The MOSFET ; Conclusions and summary ; Chapter 9 -- Transistor Biasing Circuits ; Objective of this chapter ; 9.1 -- Introduction ; 9.2 -- Emitter Feedback Bias ; 9.3 -- A simple transistor amplifier ; 9.4 -- A fixed bias circuit ; 9.5 -- The Collector bias circuit ; 9.6 -- Power considerations ; 9.7 -- Multi-stage transistor amplifiers ; 9.8 -- Operational amplifier, OpAmp ; 9.9 -- The ideal OpAmp ; Summary and Conclusions ; Appendix 9.1 -- Derivation of the stability of Collector feedback ; Chapter 10 -- Integrated circuit (IC) fabrication ; Objective of this chapter ; 10.1 -- The basic material ; 10.2 -- The Boule ; 10.2.1 -- The Czochralski method ; 10.2.2 -- The Flow-Zone method ; 10.3 -- The wafers and epitaxial growth ; 10.4 -- Photolithography ; 10.5 -- The fabrication of a pnp transistor on a silicon waver ; 10.6 -- A digression on doping ; 10.6.1 -- Thermal diffusion ; 10.6.2 -- Implantation ; 10.7 -- Resume our transistor processing ; 10.7.1 -- The contacts ; 10.7.2 -- Metallization ; 10.7.3 -- Multiple interconnects ; 10.8 -- Fabrication of other components ; 10.8.1 The integrated resistor ; 10.8.2 The integrated capacitor ; 10.8.3 Integrated inductor ; 10.9 -- Testing and Packaging ; 10.10 -- Clean rooms ; 10.11 -- Additional thoughts about processing ; Appendix 10.1 -- Miller indices in the diamond structure ; Chapter 11 -- Logic circuits ; Objectives of this chapter ; 11.1 -- Boolean algebra ; 11.2 -- The logic symbols ; 11.3 -- The electronic inside the symbols ; 11.3.1 -- Diode implementation ; 11.3.2 -- CMOS implementation ; 11.4- The inverter of NOT circuit ; 11.5 -- The NOR circuit ; 11.6 -- The NAND circuit ; 11.7 -- The XNOR or the exclusive NOR ; 11.8 -- The half adder ; 11.9 -- The full adder ; 11.10 -- Adding more than two digital numbers ; 11.11 -- The subtractor ; 11.12 -- Digression; flip-flops, latches and shifters ; 11.13 -- Multiplication and division of binary numbers ; 11.14 -- Additional comments, speed and power ; Conclusion and summary ; Appendix 11.1 -- Algebraic formulation of logic modules ; Appendix 11.2 -- Detailed analysis of the full adder ; Appendix 11.3 -- Complementary numbers ; Appendix 11.4 -- Dividing digital numbers ; Chapter 12 -- VLSI components ; Objectives of this chapter ; 12.1 -- Multiplexers, MUX ; 12.2 -- De-multiplexer, DEMUX ; 12.3 -- Registers ; 12.4 -- Timing and Waveforms ; 12.5 -- Memories ; 12.5.1 -- The Static Random-Access Memory, SRAM ; 12.5.2 -- The Dynamic Random-Access memory, DRAM ; 12.5.3 -- Read Only Memory, ROM ; 12.5.4 -- Programable Read only Memory, PROM ; 12.6 -- Gate arrays ; Conclusions and summary ; Appendix 12.1 -- A NAND implementation of a 2 to 1 MUX ; Chapter 13 -- Opto-Electronics ; Objective of this chapter ; 13.1 -- Photoconductors ; 13.2- PIN diodes ; 13.3 -- Lasers ; 13.3.1 -- The laser action ; 13.3.2 -- Solid State lasers ; 13.3.3 -- Semiconductor Lasers ; 13.3.4 -- Laser applications ; 13.4 -- Light Emitting Diodes, LEDs ; Summary and Conclusions ; Appendix 13.1 -- The detector readout ; Chapter 14 -- Microprocessors and computers ; 14.1 -- The computer ; 14.1.1 -- The computer architecture ; 14.1.2 -- The Memories ; 14.1.3 -- Input and output units ; 14.1.4 -- The central processing unit, CPU ; 14.2 -- Microcontrollers ; 14.3 -- Liquid Crystal Displays, LCDs ; 14.3.1 -- Liquid Crystal materials ; 14.3.2 -- The contacts ; 14.3.3 -- The color Filters ; 14.…”
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Terrestrial radiation effects in ULSI devices and electronic systems / by Ibe, Eishi H.

Table of Contents: “…About the Author xiii -- Preface xv -- Acknowledgements xvii -- Acronyms xix -- 1 Introduction 1 -- 1.1 Basic Knowledge on Terrestrial Secondary Particles 1 -- 1.2 CMOS Semiconductor Devices and Systems 4 -- 1.3 Two Major Fault Modes: Charge Collection and Bipolar Action 7 -- 1.4 Four Hierarchies in Faulty Conditions in Electronic Systems: Fault -- Error -- Hazard -- Failure 12 -- 1.5 Historical Background of Soft-Error Research 14 -- 1.6 General Scope of This Book 18 -- References 18 -- 2 Terrestrial Radiation Fields 23 -- 2.1 General Sources of Radiation 23 -- 2.2 Backgrounds for Selection of Terrestrial High-Energy Particles 23 -- 2.3 Spectra at the Avionics Altitude 25 -- 2.4 Radioisotopes in the Field 28 -- 2.5 Summary of Chapter 2 31 -- References 31 -- 3 Fundamentals of Radiation Effects 33 -- 3.1 General Description of Radiation Effects 33 -- 3.2 Definition of Cross Section 35 -- 3.3 Radiation Effects by Photons (Gamma-ray and X-ray) 36 -- 3.4 Radiation Effects by Electrons (Beta-ray) 37 -- 3.5 Radiation Effects by Muons 39 -- 3.6 Radiation Effects by Protons 40 -- 3.7 Radiation Effects by Alpha-Particles 43 -- 3.8 Radiation Effects by Low-Energy Neutrons 43 -- 3.9 Radiation Effects by High-Energy Neutrons 45 -- 3.10 Radiation Effects by Heavy Ions 45 -- 3.11 Summary of Chapter 3 46 -- References 46 -- 4 Fundamentals of Electronic Devices and Systems 49 -- 4.1 Fundamentals of Electronic Components 49 -- 4.1.1 DRAM (Dynamic Random Access Memory) 49 -- 4.1.2 CMOS Inverter 49 -- 4.1.3 SRAM (Static Random Access Memory) 51 -- 4.1.4 Floating Gate Memory (Flash Memory) 51 -- 4.1.5 Sequential Logic Devices 53 -- 4.1.6 Combinational Logic Devices 54 -- 4.2 Fundamentals of Electronic Systems 55 -- 4.2.1 FPGA (Field Programmable Gate Array) 55 -- 4.2.2 Processor 56 -- 4.3 Summary of Chapter 4 58 -- References 58 -- 5 Irradiation Test Methods for Single Event Effects 61 -- 5.1 Field Test 61 -- 5.2 Alpha Ray SEE Test 64 -- 5.3 Heavy Ion Particle Irradiation Test 66 -- 5.4 Proton Beam Test 71.…”
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Dispute Settlement Reports 2007.

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Dispute Settlement Reports 2008.

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